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H3C Technologies, owned by Tsinghua Unigroup and HPE, will collaborate with Foxconn to establish its first overseas factory in Malaysia, with plans to expand to the US, Mexico, and Europe. This partnership will leverage Taiwan’s precision manufacturing advantages and H3C’s expertise in AI, IoT, cloud computing, big data, and information security to facilitate Malaysia’s digital transformation. H3C has already deployed its UIS Hyper-converged Infrastructure in major hospitals in Malaysia, promoting digital management and economic development in the region. The collaboration will also utilize Foxconn’s chip manufacturing facilities in Malaysia, with an expected monthly capacity of 40,000 wafers.